MK66FX1M0VMD18 is a high-performance microcontroller (MCU) of the Kinetis K66 series launched by NXP Semiconductors, designed for embedded systems requiring high computing power, rich peripheral interfaces, and stable reliability.
MK66FX1M0VMD18 is a high-performance microcontroller (MCU) of the Kinetis K66 series launched by NXP Semiconductors, designed for embedded systems requiring high computing power, rich peripheral interfaces, and stable reliability. Equipped with an ARM Cortex-M4 core, this product integrates 1MB large-capacity flash memory and 256KB RAM, supporting multiple high-speed communication protocols and advanced peripherals. It can easily meet the complex application needs of industrial control, smart hardware, automotive electronics, and other fields, making it a cost-effective and high-performance MK66FX1M0VMD18 microcontroller solution in the current embedded market.
Key Features
High-Performance Core Drive: MK66FX1M0VMD18 adopts an ARM Cortex-M4 core with a maximum operating frequency of up to 180MHz, supporting single-precision floating-point unit (FPU) and digital signal processing (DSP) instructions. It can quickly process complex computing tasks, improving the response speed and operating efficiency of embedded systems.
Large-Capacity Storage Configuration: Built-in 1MB flash memory and 256KB static random-access memory (RAM), providing sufficient program storage and data cache space for MK66FX1M0VMD18. No additional storage chips are required, reducing the complexity and cost of system design.
Rich Peripheral Interfaces: MK66FX1M0VMD18 integrates multiple high-speed communication interfaces such as USB 2.0 OTG, Ethernet, CAN-FD, SPI, I²C, and UART. It also supports peripherals like analog-to-digital converter (ADC), pulse-width modulation (PWM), and timers, adapting to multi-scenario device connection and data acquisition needs.
Wide Temperature Range & High Reliability: With a wide operating temperature range of -40℃ to +105℃, it can operate stably in harsh environments such as industrial high temperatures and outdoor low temperatures. Meanwhile, it has passed strict electromagnetic compatibility (EMC) tests, ensuring that MK66FX1M0VMD18 is not interfered with in complex electromagnetic environments and improving the overall reliability of the device.
Low-Power Optimization Design: MK66FX1M0VMD18 supports multiple low-power modes (such as sleep mode and stop mode), which can significantly reduce power consumption in the idle state, with a minimum power consumption of approximately 10μA. It is particularly suitable for battery-powered portable smart devices, extending the device's battery life.
Technical Specifications
Specification Category
Specific Parameters
Remarks (Related to MK66FX1M0VMD18)
Core Model
ARM Cortex-M4
Core computing unit of MK66FX1M0VMD18, supporting FPU/DSP
Adapting to multiple power supply schemes to meet the power demand of MK66FX1M0VMD18
Operating Temperature Range
-40℃ ~ +105℃
Ensuring MK66FX1M0VMD18 operates stably in harsh environments
Communication Interfaces
USB 2.0 OTG, Ethernet, CAN-FD, SPI, I²C, UART
High-speed data transmission and device connection interfaces of MK66FX1M0VMD18
Analog-to-Digital Converter (ADC)
16-bit resolution, up to 24 channels
High-precision data acquisition function of MK66FX1M0VMD18
Package Type
LQFP-144 (144 pins)
Physical package form of MK66FX1M0VMD18, facilitating PCB soldering
Electromagnetic Compatibility (EMC)
Compliant with IEC 61967 standard
Ensuring the anti-interference ability of MK66FX1M0VMD18
Typical Applications
Industrial Control Field: In the industrial control field, MK66FX1M0VMD18 can perfectly adapt to devices such as programmable logic controllers (PLCs), industrial sensor data acquisition terminals, and motor drive controllers, relying on its high-performance ARM Cortex-M4 core and stable operation. Its wide temperature characteristics and rich communication interfaces (such as Ethernet and CAN-FD) enable real-time data transmission and precise control between industrial devices, improving the automation level and operational stability of production lines.
Smart Hardware Field: For smart hardware products such as smart home appliances (e.g., high-end washing machines, smart ovens) and smart home gateways, the low-power design and large-capacity storage advantages of MK66FX1M0VMD18 are particularly prominent. It can support local data processing of devices and multi-protocol communication (e.g., Wi-Fi module connection via SPI). At the same time, it extends the device's battery life (such as battery-powered smart sensors) through low-power modes, providing users with a smooth and energy-efficient smart experience.
Automotive Electronics Field: In automotive electronic scenarios such as body control modules (BCMs), in-vehicle infotainment systems, and tire pressure monitoring systems (TPMS), the wide temperature range (-40℃ ~ +105℃) and CAN-FD interface of MK66FX1M0VMD18 can meet the harsh working environment and high-speed data transmission needs of automobiles. Meanwhile, its high-reliability design ensures the long-term stable operation of in-vehicle devices, improving the safety and functionality of automotive electronic systems.
Medical Equipment Field: Medical products such as medical monitors and portable diagnostic devices have high requirements for precision and stability. The 16-bit ADC module of MK66FX1M0VMD18 can achieve high-precision physiological data (e.g., heart rate, blood pressure) acquisition, and the 1MB flash memory can store a large amount of medical algorithms and data. At the same time, its low-power characteristic adapts to the battery power supply demand of portable devices, providing precise and reliable core control support for medical equipment.
Communication Equipment Field: In communication devices such as routers, switches, and industrial gateways, the Ethernet interface and high-speed computing capability of MK66FX1M0VMD18 can realize fast data forwarding and processing. The 256KB RAM can cache a large amount of communication data to avoid data loss. Meanwhile, its anti-interference ability ensures the stable operation of the device in a complex communication environment, guaranteeing the smoothness and reliability of network communication.
Why Choose MK66FX1M0VMD18 ?
Leading Performance for Complex Tasks: MK66FX1M0VMD18 is equipped with an 180MHz ARM Cortex-M4 core, supporting FPU and DSP instructions. Its computing power is far superior to that of microcontrollers at the same price, enabling it to easily handle complex tasks such as industrial control and medical data acquisition, avoiding system freezes caused by insufficient performance.
Comprehensive Peripherals to Reduce Design Costs: MK66FX1M0VMD18 integrates multiple high-frequency interfaces such as USB, Ethernet, and CAN-FD, as well as peripherals like ADC and PWM. It can realize multi-functional requirements without additional external chips, reducing PCB area and material costs, and shortening the product development cycle.
Strong Environmental Adaptability and High Reliability: MK66FX1M0VMD18 can operate stably from low temperatures of -40℃ to high temperatures of +105℃. It has passed EMC certification and has strong anti-interference ability, which can adapt to harsh environments such as industry and automobiles, reducing the failure rate of devices.
Low-Power Design to Extend Battery Life: MK66FX1M0VMD18 supports multiple levels of low-power modes, with power consumption as low as 10μA in the idle state. For battery-powered portable devices (such as smart sensors and medical handheld devices), it can significantly extend battery life and improve user experience.
Complete Ecosystem for Convenient Development: As a product of the NXP Kinetis series, MK66FX1M0VMD18 has a mature development toolchain (such as Keil MDK and IAR EWARM) and rich reference designs. At the same time, NXP provides comprehensive technical support to help developers quickly solve development problems and accelerate product mass production.
SUNTOP COMPANY INTRODUCTION
Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost. As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.
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1. What are the flash memory and RAM capacities of MK66FX1M0VMD18? Can it meet the needs of large program storage? >
MK66FX1M0VMD18 is equipped with 1MB flash memory and 256KB RAM. Among them, 1MB flash memory can store approximately 500,000 lines of basic code (estimated at 2 bytes per line of code), and 256KB RAM can support multi-task data caching. It fully meets the large program storage and operation needs in fields such as industrial control and smart hardware, without the need for additional storage expansion.
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2. What is the operating current of MK66FX1M0VMD18? What can it reach in low-power mode? >
In normal operating mode (180MHz frequency, 3.3V voltage), the operating current of MK66FX1M0VMD18 is approximately 45mA; in sleep mode (retaining RAM data and turning off some peripherals), the current can be as low as 10μA; in deep stop mode, the current is only 2μA. It has excellent low-power performance and is suitable for battery-powered devices.
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3. What is the precision of the ADC module of MK66FX1M0VMD18? How many acquisition channels does it support at most? >
MK66FX1M0VMD18 integrates a 16-bit resolution ADC module with a conversion error of only ±1LSB (least significant bit) and extremely high acquisition precision. It supports up to 24 analog input channels, which can collect data from multiple sensors (such as temperature, pressure, and voltage) at the same time, adapting to multi-parameter monitoring scenarios (such as industrial data acquisition and medical monitoring).
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4. What is the transmission rate of the CAN-FD interface of MK66FX1M0VMD18? Can it meet the high-speed communication needs of automotive electronics? >
The maximum transmission rate of the CAN-FD interface of MK66FX1M0VMD18 can reach 8Mbps (data segment rate), which is much higher than the 1Mbps of the traditional CAN bus. It can quickly transmit a large amount of data in automotive electronics (such as vehicle status and in-vehicle entertainment information), fully meeting the high-speed communication needs of the automotive electronics industry. It is also compatible with the traditional CAN protocol, adapting to both old and new automotive systems.
Packaging data
Packaging Item
Specific Specifications
Remarks (Related to MK66FX1M0VMD18)
Packaging Type
Anti-static Tray (ESD Tray) + Vacuum Packaging
Protecting MK66FX1M0VMD18 from electrostatic and moisture damage
Quantity per Package
250 pieces/package (standard packaging)
Adapting to bulk production procurement needs; customized packaging of 100 pieces/package is also available
Storage Conditions
Temperature: -55℃ ~ +125℃; Humidity: 10% ~ 60% RH
Under unopened conditions, the shelf life of MK66FX1M0VMD18 is 2 years
Warranty Period
10 years (from the date of manufacture)
Covering the entire life cycle of MK66FX1M0VMD18
Additional Documents
Datasheet (DS), Pinout Diagram, Application Notes
Provided with the package to help users quickly understand the technical details of MK66FX1M0VMD18
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