STM32N657Z0H3Q

suntopsemi
Manufacturer
ST
Product Number
STM32N657Z0H3Q
Description
STM32N657Z0H3Q is a high-end AI Microcontroller (MCU) launched by ST, built on the Arm® Cortex®-M55 core, integrating ST Neural-ART Accelerator, Neo-Chrom 2.5D GPU, and H264 hardware encoder, designed for high-computing-power, low-power intelligent scenarios.
Inventory
24500
Datasheet
STM32N657Z0H3Q.pdf
Delivery
Payment
  • Product Overview

    STM32N657Z0H3Q is a high-end AI Microcontroller (MCU) launched by ST, built on the Arm® Cortex®-M55 core, integrating ST Neural-ART AcceleratorNeo-Chrom 2.5D GPU, and H264 hardware encoder, designed for high-computing-power, low-power intelligent scenarios. This product features 4.2 Mbyte contiguous SRAM, 128-Kbyte data TCM (with ECC) and 64-Kbyte instruction TCM (with ECC), supporting rich peripherals (such as 2x USB 2.0 HS/FS OTG, Gigabit Ethernet TSN, 3x FDCAN). It also meets SESIP Level 3 and Arm® PSA certification, balancing computing power, security, and flexibility, making it widely applicable to high-end scenarios like industrial intelligence, intelligent vision, and in-vehicle cockpits.

    Key Features

    • Powerful Heterogeneous Computing Power for Efficient AI Processing:Equipped with Arm® Cortex®-M55 core (up to 800 MHz, 3360 CoreMark, 1280 DMIPS), combined with ST Neural-ART Accelerator (up to 1 GHz frequency, 600 Gops computing power, 288 MAC/cycle), it hardware-accelerates DNN inference, supports real-time weight decompression and data encryption/decryption, meeting the needs of complex AI tasks.
    • Highly Integrated Graphics and Video Capabilities:Built-in Neo-Chrom 2.5D GPU (supports scaling, rotation, texture mapping) and hardware H264 encoder (Baseline/Main/High Profile, supporting 1080p30, 720p60 resolution), paired with JPEG codec and LCD-TFT controller (up to XGA resolution), enabling high-definition graphics display and video encoding without external chips.
    • Large-Capacity Secure Memory Configuration:Integrates 4.2 Mbyte contiguous SRAM, 128-Kbyte data TCM + 64-Kbyte instruction TCM (both with ECC error correction), 8-Kbyte VBAT mode backup SRAM. It also supports XSPI (HyperRAM™/HyperFlash™) and FMC for external storage, balancing data security and storage expandability.
    • Comprehensive Security Protection System:Certified by SESIP Level 3 and Arm® PSA, supporting Arm® TrustZone®, dual AES coprocessors (with DPA side-channel attack resistance), PKA public key accelerator, Hardware Unique Key (HUK), and real-time external memory encryption/decryption, ensuring the security of sensitive data and firmware.
    • Low-Power and Wide Operating Condition Adaptation:Supports Sleep/Stop/Standby low-power modes, VBAT domain power supply (RTC, backup registers), operating voltage range of 1.71~3.6 V, and ambient temperature range of -40~125 °C, adapting to harsh environments such as industrial and in-vehicle scenarios.

    Technical Specifications

    CategorySpecification Parameters
    Core ArchitectureArm® Cortex®-M55, up to 800 MHz; 3360 CoreMark, 1280 DMIPS; 32-Kbyte ICACHE/DCACHE
    Neural AcceleratorST Neural-ART Accelerator, up to 1 GHz, 600 Gops, 288 MAC/cycle; supports DNN inference
    Graphics & VideoNeo-Chrom 2.5D GPU; H264 encoder (1080p30/720p60); JPEG codec; LCD-TFT controller (XGA)
    Memory Configuration4.2 Mbyte contiguous SRAM; 128-Kbyte DTCM + 64-Kbyte ITCM (with ECC); 8-Kbyte backup SRAM (VBAT)
    Storage InterfaceXSPI (8/16-bit, up to 200 MHz, supports HyperRAM™/HyperFlash™); FMC (SRAM/PSRAM/SDRAM/NOR/NAND)
    Communication Peripherals2x USB 2.0 HS/FS OTG (with UCPD Type-C PD); Gigabit Ethernet TSN; 3x FDCAN; 4x I2C Fm+; 6x SPI (4x I2S-supported)
    Security FeaturesSESIP Level 3, PSA certification; TrustZone®; AES (DPA resistant), PKA, HASH, TRNG (NIST SP800-90B)
    Power & TemperatureOperating voltage 1.71~3.6 V; ambient temperature -40~125 °C; supports Sleep/Stop/Standby modes
    PackageVFBGA142 (8 x 8 mm, 0.5 mm pin pitch, 75 IOs)

    Typical Applications

    • Industrial Intelligent Gateway:With Gigabit Ethernet TSN and multi-protocol communication (FDCAN, I2C, SPI), STM32N657Z0H3Q can serve as the core of industrial IoT gateways, collecting sensor data in real time and performing edge AI analysis (such as equipment fault prediction) via the ST Neural-ART Accelerator. Meanwhile, it ensures industrial data transmission security relying on TrustZone®, adapting to the -40~125 °C industrial temperature range.
    • Intelligent Vision Surveillance Devices:Integrating parallel/CSI-2 camera interfaces, ISP (supporting bad pixel repair, noise reduction, YUV conversion) and H264 hardware encoder (1080p30), it can directly connect to high-definition cameras for video capture and encoding. Cooperating with the NPU, it realizes real-time AI tasks like human detection and behavior recognition, suitable for home surveillance and industrial vision inspection equipment.
    • In-Vehicle Intelligent Cockpit Module:Supporting USB Type-C PD power supply, FDCAN in-vehicle bus, and high-resolution LCD-TFT display, it can drive cockpit central control screens and instrument panels. The Neo-Chrom GPU enables smooth 2.5D graphics rendering, while SESIP Level 3 security certification ensures that in-vehicle system firmware and user data are not tampered with.
    • Medical Diagnostic Equipment:The 12-bit ADC (up to 5 Msps) and digital temperature sensor (DTS) can accurately collect physiological signals (such as heart rate, blood oxygen). The 4.2 Mbyte large memory can cache multiple sets of detection data, and the NPU accelerates medical data feature extraction, meeting the accuracy and real-time requirements of portable ultrasound and ECG monitoring equipment. The wide-temperature design adapts to medical scenario environments.
    • High-End Consumer Electronics (AR/VR Accessories):Low-power modes and high integration reduce the power consumption of AR/VR controllers, smart glasses and other devices. The H264 encoder supports local video recording, and SPI/I2S interfaces connect to audio modules for voice interaction. Meanwhile, hardware security protection prevents user privacy data leakage, enhancing the consumer product experience.

    Why Choose STM32N657Z0H3Q ?

    • Leading Edge AI Computing Power600 Gops neural accelerator + 800 MHz Cortex-M55 core, hardware-accelerating DNN inference. Compared with MCU of the same level, the computing power is increased by more than 3 times, capable of handling complex AI tasks (such as real-time image classification) without external AI chips, reducing hardware costs.
    • High Integration Simplifies Design:Integrating GPU, H264 encoder, ISP, and multiple high-speed peripherals reduces the number of external chips (such as separate video encoding chips and graphics chips), lowering BOM costs by 20%~30% while reducing PCB area, adapting to miniaturized device requirements.
    • Military-Grade Security Assurance:Certified by SESIP Level 3 and Arm® PSA, with built-in DPA-resistant encryption modules and Hardware Unique Key (HUK), it can resist side-channel attacks, firmware tampering and other security threats, meeting high-security requirements of industrial, in-vehicle, and medical scenarios.
    • Flexible Low-Power Management:Supports multi-level voltage scaling and Sleep/Stop/Standby modes, with current as low as microamp level in Stop mode. The VBAT domain backup SRAM can save key data during power failure, adapting to battery-powered portable devices (such as handheld detection instruments) and extending battery life.
    • Extensive Ecosystem and Compatibility:Compatible with STM32 series development tools (such as STM32CubeIDE) and software libraries (STM32CubeMX), providing rich drivers and sample code. It also supports various external storage (HyperRAM™, SDRAM) and peripheral interfaces, shortening product development cycles.

    SUNTOP COMPANY INTRODUCTION

    Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
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  • +
    1. What is the specific computing power of the Neural Processing Unit (NPU) in STM32N657Z0H3Q? >
    Its ST Neural-ART Accelerator has a maximum operating frequency of 1 GHz, providing 600 Gops of computing power and supporting 288 MAC operations per cycle. It supports real-time weight decompression and DNN inference hardware acceleration, and can efficiently process mainstream neural network models such as MobileNet and ResNet.
    +
    2. What is the maximum video encoding resolution and frame rate supported by this product? >
    The built-in H264 hardware encoder supports Baseline/Main/High Profile (Level 1~5.2), and can achieve a maximum video encoding of 1080p (1920x1080) resolution at 30 frames per second (1080p30) or 720p (1280x720) resolution at 60 frames per second (720p60), meeting high-definition video recording and transmission needs.
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    3. Does the memory configuration of STM32N657Z0H3Q support error correction for critical data? >
    Yes. The product is equipped with 128-Kbyte data TCM (Tightly Coupled Memory) and 64-Kbyte instruction TCM, both integrated with ECC (Error Correction Code), which can detect and correct single-bit errors and detect double-bit errors, ensuring the integrity of real-time data (such as AI inference intermediate results, industrial control parameters). Meanwhile, the 4.2 Mbyte contiguous SRAM supports hardware erasure and software erasure, improving data security.
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    4. Which security certifications has this MCU obtained? What high-security scenarios can it be applied to? >
    STM32N657Z0H3Q has obtained SESIP Level 3 (Security Evaluation Standard for IoT Platforms) and Arm® PSA (Platform Security Architecture) certification, with built-in TrustZone® and DPA-resistant AES/PKA modules. It can be applied to high-security scenarios such as in-vehicle (functional safety-related modules), medical (patient data protection), and industrial (device identity authentication).
  • Packaging data

    Product Model Package Type Package Size Pin Pitch Number of IOs Compliance Standard
    STM32N657Z0H3Q VFBGA142 8 x 8 mm 0.5 mm 75 ECOPACK2
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