MCIMX6Q5EYM10AD

suntopsemi
Manufacturer
NXP
Product Number
MCIMX6Q5EYM10AD
Description
MCIMX6Q5EYM10AD is a high-end application processor (AP) from NXP’s i.MX 6Quad Series, based on the high-performance ARM®
Inventory
54610
Datasheet
MCIMX6Q5EYM10AD.pdf
Delivery
Payment
  • Product Overview

    MCIMX6Q5EYM10AD is a high-end application processor (AP) from NXP’s i.MX 6Quad Series, based on the high-performance ARM® Cortex-A9 quad-core architecture, designed for scenarios requiring high performance and multimedia capabilities such as consumer electronics, industrial control, and automotive aftermarket. This product supports a maximum clock frequency of 1 GHz, DDR3/DDR3L/LPDDR2 high-speed memory, and integrates top-tier multimedia modules including VPU (Video Processing Unit), tri-core GPU (3D/2D/OpenVG), and dual IPU (Image Processing Unit). Adopting a 21mm×21mm lidless FCPBGA package (0.8mm pin pitch), it operates within a voltage range of 1.8-3.6 V and a temperature range of -20°C to 105°C (Extended Commercial Grade), perfectly suitable for high-end mobile devices, industrial gateways, smart terminals, and other complex applications. As the core model of the i.MX 6Quad Series, its balanced performance, rich multimedia capabilities, and comprehensive peripheral interfaces make it an optimal choice for mid-to-high-end embedded systems.

    Key Features

    • High-Performance Quad-Core Architecture:Features a quad-core ARM® Cortex-A9 MPCore with a maximum frequency of 1 GHz, 3-stage pipeline design, integrated 1MB shared L2 cache and NEON MPE media coprocessor. Its computing efficiency is far superior to peer processors, easily handling multitasking and complex algorithms.
    • Full-Scenario Storage Support:Supports 16/32/64-bit DDR3/DDR3L/LPDDR2 memory (up to 1066 MHz), compatible with various storage devices such as NAND Flash (MLC/SLC), NOR Flash, and eMMC. BCH ECC error correction capability up to 40 bits meets high-capacity and high-reliability storage requirements.
    • Top-Tier Multimedia Processing:Integrates multi-standard VPU (supports 1080p HD video encoding/decoding), OpenGL ES 2.0 3D GPU (4 shaders, 200 MTri/s), 2D graphics accelerator, and OpenVG 1.1 accelerator. Dual IPUs support multi-display output and image enhancement, adapting to HD display and complex graphics applications.
    • Rich Peripheral Interfaces:Covers 10/100/1000 Mbps Gigabit Ethernet (IEEE1588 compliant), 1x USB 2.0 OTG + 3x USB 2.0 Host (including HSIC PHY), 2x CAN interfaces, 5x UARTs, 3x I2Cs, 5x eCSPIs, etc. It also supports HDMI 1.4, MIPI DSI/CSI, LVDS display bridge, and other display and camera interfaces, covering full-scenario interconnection needs.
    • Intelligent Low-Power Design:Integrates Dynamic Voltage and Frequency Scaling (DVFS) technology, supporting multiple low-power modes (standby/deep sleep, etc.). Combined with integrated LDO voltage regulators, it achieves precise balance between high-performance operation and low-power endurance.
    • High Reliability and Security:Operates within a temperature range of -20°C to 105°C, with ESD protection up to ±2000 V (HBM). Integrates CAAM cryptographic acceleration module, TrustZone security architecture, secure boot (HABv4), and code read protection to ensure data and system security.

    Technical Specifications

    ItemSpecification
    CoreQuad-core ARM® Cortex-A9 MPCore, up to 1 GHz clock frequency, NEON MPE coprocessor
    Operating VoltageCore supply: 0.9-1.5 V; I/O supply: 1.8/2.5/3.3 V (wide voltage adaptation)
    Operating Temperature-20°C to 105°C (Extended Commercial Grade, Tj)
    Storage SupportSupports DDR3/DDR3L/LPDDR2 (up to 1066 MHz), maximum 4GB memory space; compatible with NAND/NOR/eMMC/PSRAM and other storage devices
    Analog ModulesIntegrated Power Management Unit (PMU), temperature sensor, analog comparator
    Communication Interfaces1x Gigabit Ethernet (IEEE1588), 1x USB 2.0 OTG + 3x USB 2.0 Host, 2x CAN (1 Mbps), 5x UART (up to 5 Mbps), 3x I2C (400 kbps), 5x eCSPI, 1x SATA II (3 Gbps), 1x PCIe 2.0 (x1 lane)
    Special PeripheralsVPU (1080p encoding/decoding), dual IPUv3H, tri-core GPU (3D/2D/OpenVG), 4x uSDHC (supports UHS-I SDR104), HDMI 1.4, MIPI DSI/CSI, LVDS display bridge, 8x8 Keypad Port, SPDIF audio interface
    GPIO CountUp to 165 general-purpose I/O pins (supports interrupts, programmable pull-up/pull-down)
    Package Type21x21 mm FCPBGA (lidless), 0.8 mm pin pitch
    Power ConsumptionTypical power consumption ~2.5 W in Run mode (1 GHz), μA-level power consumption in deep sleep mode
    Safety FeaturesTrustZone security architecture, CAAM cryptographic engine, HABv4 secure boot, CRC verification, ESD HBM ±2000 V

    Typical Applications

    • Consumer Electronics:Suitable for high-end portable media players, game consoles, and smart navigation devices. 1080p video decoding and 3D graphics acceleration meet HD entertainment needs, and rich interfaces support peripheral expansion.
    • Industrial Control:Used in industrial gateways, PLC main controllers, and machine vision terminals. Quad-core performance guarantees the operation of complex control algorithms, Gigabit Ethernet and multi-serial ports support device networking and data interaction, and wide-temperature design adapts to industrial environments.
    • Automotive Aftermarket:Fits in-vehicle navigation, in-vehicle entertainment systems, and fleet monitoring terminals. Wide-voltage design is compatible with in-vehicle power supplies, CAN interface supports in-vehicle bus communication, and multimedia capabilities meet HD display and audio needs.
    • Smart Terminals:Applicable to high-end tablets, netbooks, and nettops. Quad-core processor and large memory support multitasking, and HDMI and MIPI interfaces adapt to various display devices.
    • Medical Equipment:Used in portable medical monitors and medical imaging terminals. High reliability and security features ensure medical data security, and multimedia processing capabilities support image display and analysis.

    Why Choose MCIMX6Q5EYM10AD ?

    • Strong Quad-Core Performance:1 GHz quad-core Cortex-A9 architecture + 1MB L2 cache, outstanding computing power, easily handling multitasking, complex algorithms, and HD multimedia processing.
    • Top-Tier Multimedia Capabilities:Integrates VPU, tri-core GPU, and dual IPU, supporting 1080p encoding/decoding and 3D graphics acceleration. High-end audio and video functions can be achieved without additional expansion chips.
    • Comprehensive Interface Coverage:Complete interfaces including Gigabit Ethernet, USB 2.0 full suite, CAN, and SATA, compatible with various peripherals such as display, storage, and communication, reducing system integration difficulty.
    • Low Power Consumption for Energy Saving:DVFS dynamic voltage and frequency scaling + multiple low-power modes balance performance and energy consumption, adapting to battery-powered and long-term operation scenarios.
    • Reliable and Secure:Extended commercial-grade wide temperature range, ESD protection, and multiple security mechanisms adapt to complex environments such as industrial and automotive, ensuring system stability and data security.

    SUNTOP COMPANY INTRODUCTION

    Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
    As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.

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  • +
    1. What is the core frequency and core count of MCIMX6Q5EYM10AD? >
    It is equipped with a quad-core ARM® Cortex-A9 core, with a maximum frequency of 1 GHz, integrated 1MB shared L2 cache and NEON media coprocessor, featuring high computing efficiency.
    +
    2. What is the operating temperature range of the product? >
    Supports an extended commercial temperature range of -20°C to 105°C, adapting to the environmental needs of consumer, industrial, automotive aftermarket and other scenarios.
    +
    3. Which types of memory and storage devices are supported? >
    Supports DDR3/DDR3L/LPDDR2 high-speed memory (up to 1066 MHz), compatible with NAND Flash (MLC/SLC), NOR Flash, eMMC, PSRAM and other storage devices, with BCH ECC error correction up to 40 bits.
    +
    4. What are the core multimedia functions? >
    Integrates VPU (1080p HD video encoding/decoding), OpenGL ES 2.0 3D GPU (200 MTri/s), 2D graphics accelerator, and OpenVG 1.1 accelerator. Dual IPUs support multi-display output and image enhancement.
  • Packaging data

    Model Package Type Packaging Method Standard Package Quantity Package Dimension
    MCIMX6Q5EYM10AD 21×21 mm FCPBGA (lidless), 0.8 mm pin pitch Tape and Reel 1000 units/reel 21 mm × 21 mm × 1.45 mm
    MCIMX6Q5EYM10AD 21×21 mm FCPBGA (lidless), 0.8 mm pin pitch Trays 250 units/tray 21 mm × 21 mm × 1.45 mm
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