HSMF-C165

suntopsemi
Manufacturer
Broadcom
Product Number
HSMF-C165
Description
HSMF-C165 is a high-performance bi-color surface mount chip LED featuring an industry-standard 0603 package (1.6×0.8mm size, 0.5mm ultra-thin thickness).
Inventory
68000
Datasheet
HSMF-C165.pdf
Delivery
Payment
  • Product Overview

    HSMF-C165 is a high-performance bi-color surface mount chip LED featuring an industry-standard 0603 package (1.6×0.8mm size, 0.5mm ultra-thin thickness). It offers a dual-color combination of High Efficiency Red (HER) and GaP Green, with untinted and diffused optical properties. Compatible with reflow soldering processes and supporting automated placement, this product stands out for its ultra-small size, integrated bi-color design, and stable wide-temperature operating performance. It is an ideal choice for high-density mounting scenarios such as mobile devices and consumer electronics, widely suitable for keypad backlighting, symbol indication, panel illumination, and other diverse needs.

    Key Features

    • Integrated Bi-Color Design: Combines High Efficiency Red (HER) and GaP Green in one package, eliminating the need for additional matching and simplifying circuit design
    • Extremely Compact Size: 1.6×0.8×0.5mm ultra-small volume with industry-standard 0603 footprint, saving PCB space
    • Superior Optical Performance: Diffused epoxy resin material, 120° wide viewing angle, uniform and soft light emission with high color recognition
    • Wide Temperature Stable Operation: Adaptable to the full temperature range of -40°C to +85°C, withstanding extreme environments for broader application scenarios
    • Convenient Soldering Compatibility: Compatible with reflow soldering processes, supplied in tape and reel with 4000 units per reel to support automated mass production

    Technical Specifications

    ItemSpecification Details
    Package TypeSurface Mount Technology (SMT), Untinted, Diffused
    Package Dimensions1.6×0.8×0.5mm (Length×Width×Height)
    Emitting Color CombinationHigh Efficiency Red (HER) / GaP Green
    Forward Voltage (IF=20mA)High Efficiency Red: Typical 1.95V, Maximum 2.6V; GaP Green: Typical 2.2V, Maximum 2.6V
    DC Forward Current (TA=25°C)High Efficiency Red: 20mA; GaP Green: 20mA (Absolute Maximum per die)
    Luminous Intensity (IF=20mA)High Efficiency Red: Minimum 2.8mcd, Typical 10mcd; GaP Green: Minimum 4.5mcd, Typical 15mcd
    Peak WavelengthHigh Efficiency Red: Typical 636nm; GaP Green: Typical 570nm
    Dominant WavelengthHigh Efficiency Red: Typical 621nm; GaP Green: Typical 572nm
    Viewing Angle (2θ1/2)Typical 120°
    Reverse Voltage (IR=100μA)Minimum 5V (Applicable to both bi-color dies)
    Power Dissipation (TA=25°C)High Efficiency Red: 52mW; GaP Green: 52mW
    Reverse Capacitance (VF=0V, f=1MHz)High Efficiency Red: Typical 5pF; GaP Green: Typical 9pF
    Thermal Resistance (RθJ-PIN)High Efficiency Red: Typical 325°C/W; GaP Green: Typical 325°C/W
    Operating Temperature Range-40°C to +85°C
    Storage Temperature Range-40°C to +85°C

    Typical Applications

    • Keypad Backlighting: With its integrated bi-color design and ultra-small package, HSMF-C165 perfectly fits the key backlighting of smartphones, tablets, portable keyboards, and other devices. Red and green light can be switched on demand, enhancing operational recognition and visual experience.Symbol Indication: Suitable for function symbols and status indicator signs of electronic devices (such as power, signal, and warning symbols). Bi-color emission can distinguish different working states, and the diffused optical design ensures clear visibility from a distance.LCD Backlighting: Adaptable as a backlight source for small LCD screens (such as smart wearables and portable meters). The bi-color combination can achieve basic color matching, and the ultra-thin thickness does not occupy excessive internal space of the device.Push-button Backlighting: Used in scenarios such as home appliance control panels and industrial equipment buttons. The wide temperature range adapts to complex indoor and outdoor environments, and bi-color indication makes operation feedback more clear, improving usability.Front Panel Indicator: Meets the front panel status indication needs of consumer electronics and industrial control equipment. The high-density mounting feature supports the integration of multiple indicators, and stable optoelectronic performance ensures accurate and reliable indicator signals.

    Why Choose HSMF-C165 ?

    • Integrated bi-color package reduces the number of components, simplifies circuit design and installation processes, and lowers production costs
    • 0.5mm ultra-thin thickness + 1.6×0.8mm compact size, compatible with high-density PCB layouts, solving space challenges for small devices
    • 120° wide viewing angle + diffused light emission design, uniform color without glare, high bi-color recognition, and excellent visual experience
    • Wide operating temperature range of -40°C to +85°C, strong environmental adaptability, covering consumer, industrial, mobile and other multi-field needs
    • Compatible with reflow soldering and automated placement, standardized tape and reel packaging specifications, high mass production efficiency and stable yield

    SUNTOP COMPANY INTRODUCTION

    Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
    As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.

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  • +
    1. What is the specific bi-color combination of HSMF-C165? >
    It adopts an integrated design of High Efficiency Red (HER) and GaP Green, with peak wavelengths of 636nm (red light) and 570nm (green light) respectively, ensuring stable color performance.
    +
    2. What is the maximum forward current of each die of HSMF-C165? >
    The absolute maximum DC forward current (TA=25°C) for both High Efficiency Red and GaP Green dies is 20mA, and linear derating is required above 25°C.
    +
    3. What are the specific luminous intensity parameters of HSMF-C165? >
    Under the condition of IF=20mA, the High Efficiency Red has a minimum of 2.8mcd and a typical value of 10mcd; the GaP Green has a minimum of 4.5mcd and a typical value of 15mcd, providing sufficient brightness for most scenarios.
    +
    4. What are the operating and storage temperature ranges supported by HSMF-C165? >
    The operating temperature range is the same as the storage temperature range, both from -40°C to +85°C, capable of withstanding extreme high and low temperature environments.
  • Packaging data

    Packaging Type Detailed Parameters
    Package Form Tape and Reel (8mm Carrier Tape)
    Quantity per Reel 4000 units/reel
    Reel Diameter 7 inches (178mm)
    Carrier Tape Dimensions (DIM.A/B/C) DIM.A: 1.75±0.10mm, DIM.B: 0.95±0.10mm, DIM.C: 0.60±0.10mm
    Storage Conditions 5°C to 30°C environment with maximum relative humidity of 60%; unopened packages should be protected from humid environments
    Baking Conditions Baking at 60±5°C for 20 hours is required if the silica gel desiccant turns white/transparent or the package has been opened for more than 672 hours
    Shipping Package Hermetically sealed moisture barrier bag with desiccant and humidity indicator card
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