HD64F3687FP

suntopsemi
Manufacturer
RENESAS
Product Number
HD64F3
Description
HD64F3687FP is a high-performance 16-bit single-chip microprocessor launched by Renesas Electronics, belonging to the H8/3687 Group.
Inventory
23000
Datasheet
HD64F3687FP.pdf
Delivery
Payment
  • Product Overview

    HD64F3687FP is a high-performance 16-bit single-chip microprocessor launched by Renesas Electronics, belonging to the H8/3687 Group. Based on the high-speed H8/300H CPU architecture, it is compatible with the H8/300 CPU instruction set. This chip integrates rich peripheral functions and memory resources, supports flexible programming and low-power operation, and is suitable for various embedded application scenarios, providing an efficient and stable control core for devices.

    Key Features

    • High-Performance Processing Core: Equipped with a high-speed H8/300H CPU with a 16-bit internal architecture, featuring 16 16-bit general-purpose registers and 62 basic instructions, supporting 8/16/32-bit data processing for efficient computing.
    • Rich Peripheral Integration: Includes real-time clock (RTC), multi-channel timers (Timer B1, Timer V, Timer Z), 14-bit PWM, SCI3 serial communication interface, I²C bus interface, and 10-bit A/D converter, meeting diverse control needs.
    • Flexible Storage and Programming: Built-in 56KB flash memory and 4KB RAM, supporting on-board programming/erasing. The flash memory can be reprogrammed up to 1000 times, adapting to dynamic update requirements.
    • Low-Power Design: Supports multiple power-saving modes (sleep mode, standby mode, etc.). The power supply circuit can be partially turned off in subactive mode to reduce operating power consumption.
    • Compact Package: Adopts LQFP-64 (FP-64E) package with a size of 10.0×10.0mm, suitable for space-constrained application scenarios.

    Technical Specifications

    ItemDetails
    CPU TypeH8/300H 16-bit microprocessor
    Instruction SetCompatible with H8/300 CPU, 62 basic instructions
    Memory56KB Flash, 4KB RAM
    TimersTimer B1 (8-bit), Timer V (8-bit), Timer Z (16-bit)
    Communication InterfacesSCI3 (asynchronous/synchronous serial), I²C bus
    A/D Converter10-bit resolution
    Package TypeLQFP-64 (FP-64E)
    Package Size10.0×10.0mm, Pin Pitch 0.5mm
    Operating VoltageRefer to Electrical Characteristics section

    Typical Applications

    • Industrial Automation Equipment: The multiple timers and A/D conversion functions of HD64F3687FP can precisely control the motion trajectory of industrial robots and sensor data collection, improving equipment response speed and control accuracy.
    • Smart Home Appliances: With low-power modes and rich I/O interfaces, it is suitable for smart refrigerators, washing machines and other home appliances, realizing real-time monitoring and intelligent adjustment of temperature, humidity and other parameters.
    • Communication Devices: Through the SCI3 serial communication interface and I²C bus, it can serve as the control core of communication modules, supporting stable data transmission and collaborative work between devices.
    • Medical Monitoring Instruments: The 10-bit A/D converter can accurately collect physiological signals (such as heart rate, blood pressure), and cooperate with RTC to realize timed monitoring, providing reliable control support for medical equipment.
    • Test and Measurement Equipment: The high-speed CPU and multi-channel timers can quickly process measurement data, ensuring high sampling rate and data accuracy of test equipment, suitable for oscilloscopes, signal generators and other scenarios.

    Why Choose HD64F3687FP?

    • Efficient Processing Capability: The H8/300H CPU supports 32-bit data operations, and key instructions can be executed in only 1-2 states, meeting real-time control requirements.
    • One-Stop Peripheral Solution: Integrates timers, communication interfaces, A/D and other peripherals, reducing the need for external components and lowering system design complexity.
    • Flexible Flash Management: Supports on-board programming and block erasing, adapting to on-site upgrades and dynamic function updates, extending product lifecycle.
    • Low-Power Advantage: Multiple power-saving modes can adjust power consumption according to application scenarios, extending the service time of battery-powered devices.
    • Compact Design: The miniaturized package is suitable for space-constrained embedded devices, simplifying PCB layout and reducing production difficulty.

    SUNTOP COMPANY INTRODUCTION

    Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
    As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.

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  • +
    1. What is the flash memory capacity of HD64F3687FP? >
    It has a built-in 56KB Flash memory, supporting block erasing (1KB×4, 28KB×1, etc.), meeting the storage needs of medium and large programs.
    +
    2. What is the RAM capacity of this chip? >
    Equipped with 4KB RAM, which can be used for data caching and temporary variable storage to ensure efficient program operation.
    +
    3. What package does HD64F3687FP use? >
    It adopts LQFP-64 (FP-64E) package with a size of 10.0×10.0mm and a pin pitch of 0.5mm, suitable for high-density PCB design.
    +
    4. How many times can the flash memory be reprogrammed? >
    The flash memory supports up to 1000 reprogramming cycles, meeting multiple upgrade needs during the product lifecycle.
  • Packaging data

    Package Type Code Body Size Pin Pitch
    LQFP-64 FP-64E 10.0×10.0mm 0.5mm
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