EP3C10F256I7N

suntopsemi
Manufacturer
Intel
Product Number
EP3C1
Description
EP3C10F256I7N is a low-cost Cyclone III series FPGA from Altera (now part of Intel), fabricated using a 90nm process.
Inventory
35000
Datasheet
EP3C10F256I7N.pdf
Delivery
Payment
  • Product Overview

    EP3C10F256I7N is a low-cost Cyclone III series FPGA from Altera (now part of Intel), fabricated using a 90nm process. It features 10,320 logic elements (LEs), a 256-pin FineLine BGA package, and supports rich I/O interfaces and embedded memory resources. Suitable for industrial control, consumer electronics, communication equipment, etc., it provides a flexible programmable solution for complex digital logic designs.

    Key Features

    1. High Logic Density: Includes 10,320 logic elements and 512KB embedded RAM (M4K RAM blocks), supporting complex algorithms and data buffering for medium-scale logic design requirements.
    2. Rich I/O Resources: 256-pin package offers up to 182 user I/Os, compatible with LVTTL, LVCMOS, SSTL, PCI, and other 电平 standards, adapting to diverse peripheral connections.
    3. Low-Power Design: 90nm process combined with dynamic power management, with static power consumption as low as 0.5W (typical), suitable for battery-powered or power-sensitive devices.
    4. Flexible Clock Management: Integrates 2 phase-locked loops (PLLs) supporting clock multiplication, division, and phase adjustment, meeting multi-clock domain synchronization needs.
    5. User-Friendly: Compatible with Quartus II development software, supporting Verilog/VHDL hardware description languages, and providing rich IP cores (e.g., UART, SPI, FIFO) to accelerate design flow.

    Technical Specifications

    Item Details
    Model EP3C10F256I7N
    Series Cyclone III
    Logic Elements (LE) 10,320
    Embedded RAM 512KB (132 M4K RAM blocks, 3,6864bit each)
    Phase-Locked Loops (PLL) 2 (support differential/single-ended input)
    Max User I/Os 182
    Package Type 256-pin FineLine BGA (F256)
    Operating Temperature Range -40℃ to +100℃ (industrial grade)
    Process Node 90nm

    Typical Applications

    • Industrial Automation Control: Serves as the core of motion controllers, using logic elements for pulse generation and encoder signal processing, connecting sensors and actuators via rich I/Os to support real-time control algorithms.
    • Smart Home Appliance Main Control: Integrates motor control, human-machine interaction (buttons/displays), and communication functions in high-end home appliances. Programmable features adapt to differentiated needs of different product models, reducing hardware modification costs.
    • Communication Interface Conversion: Supports high-speed interfaces like LVDS and SGMII, enabling protocol conversion for Ethernet and USB. Connects devices with different communication standards in industrial gateways, simplifying system architecture.
    • Medical Equipment Modules: Used for data collection and processing in monitors. Embedded RAM caches sensor data, and PLL synchronizes AD sampling clocks to ensure data accuracy and real-time performance.
    • Education and Training Platforms: Serves as the core of FPGA teaching experiment equipment. Its low cost and moderate logic scale are suitable for students to learn digital circuit design, timing analysis, and hardware programming, compatible with mainstream development tools.

    Why Choose EP3C10F256I7N?

    • Outstanding Cost-Effectiveness: Balances logic resources and cost in the Cyclone III series, 15%-20% lower than peer FPGAs, suitable for mass-produced products to control costs.
    • High Design Flexibility: Programmable features support on-site firmware upgrades, enabling function updates without hardware replacement, extending product lifecycle.
    • Industrial-Grade Reliability: -40℃ to +100℃ wide temperature range and anti-EMI design, passing IEC 61000-4 immunity tests, adapting to harsh industrial environments.
    • Rich Development Resources: Quartus II software provides timing analysis and power optimization tools, with supporting development boards (e.g., DE0-Nano) shortening prototype verification cycles.
    • Strong Compatibility: Supports collaboration with processors like ARM and MCU, enabling heterogeneous system integration via parallel interfaces or high-speed buses (e.g., SPI) to expand functional boundaries.

    SUNTOP COMPANY INTRODUCTION

    Founded in 2000, Suntop is one of the leading global distributors of electronic components, dedica ted to providing comprehensive procurement and supply chain services to the global electronics manufacturing industry. Our services include distribution, spot trading, PPV cost-saving projects, and inventory management. We not only offer high-quality products but also strive to assist our clients in achieving optimal solutions with minimal time and cost.
    As a trusted partner for numerous OEMs, ODMs, CEMs, and EMS companies worldwide, our professional team manages millions of component records from thousands of trading partners across dozens of countries daily through our company database. We maintain close business relationships with major factories and distributors in North America, Europe, and Asia to ensure that our clients stay ahead in a highly competitive market.

    suntopsemi-logo

  • +
    1. How many logic elements does EP3C10F256I7N have? >
    It contains 10,320 logic elements (LEs), each consisting of a 4-input lookup table (LUT) and a flip-flop, capable of implementing combinational and sequential logic functions.
    +
    2. What is the embedded RAM capacity and structure? >
    The total capacity is 512KB, composed of 132 M4K RAM blocks. Each block supports single-port/double-port modes and can be configured as FIFO, ROM, or register files to meet data buffering needs.
    +
    3. Which I/O voltage standards are supported? >
    It supports LVTTL (3.3V/2.5V), LVCMOS (1.8V/1.5V/1.2V), SSTL-2/3 (memory interfaces), PCI (33MHz), etc. Each I/O bank can be independently configured for voltage levels.
    +
    4. What is the operating temperature range? >
    It is an industrial-grade device with an operating temperature range of -40℃ to +100℃, enabling stable operation in high and low temperature environments.
  • Packaging data

    Package Type Quantity (pcs/package) Package Size
    Tray Packaging 20 17mm×17mm (BGA)
  • SUNTOP’s mode of transportation

    UPS

    One of the largest package delivery companies globally, with a robust ground network. Offers specialized services like supply chain management and healthcare logistics, covering 200+ countries/regions.

    DHL

    Leads in global international express market share, with a dominant position in Europe. Specializes in cross-border logistics, bulk cargo, and document delivery. Divisions include DHL Express and DHL Supply Chain.

    TNT

    Formerly known for its European road network and time-definite delivery services. Now integrated into FedEx’s operations to enhance its European market presence.

    SF

    China’s largest integrated logistics provider, known for high-speed delivery and a direct-operated business model. Covers domestic and key international markets, offering services like cold chain logistics, supply chain solutions, and air cargo (with its own freighter fleet).

    Fedex

    Fedex is an international express delivery group that offers overnight express delivery, ground express delivery, heavy cargo transportation, document copying and logistics services.
Hot Products
Hot Products
Contact Us

    SUNTOP by the numbers